Our company has long been engaged in the production and service of electronic-grade ultra-pure reagents (CMOS grade, MOS grade and low-particle ultra-pure reagents suitable for the production of integrated circuits and discrete devices), electronic chemicals and general reagents.
1. Quality Management System: GB/T 19001-2016 (equivalent to ISO 9001:2015)
2. Environmental Management System: GB/T 24001-2016 (equivalent to ISO 14001:2015)
3. Occupational Health and Safety Management System: GB/T 45001-2020 (equivalent to ISO 45001:2018)
Capability Guarantee: Stably provide chemical products and services that meet customer requirements and comply with environmental and occupational health and safety laws and regulations:
Continuous Improvement: Optimize the management system through the PDCA cycle to ensure compliance and enhance customer satisfaction;
Social Responsibility: Strengthen environmental protection measures, ensure employees' occupational health and safety, and achieve sustainable development.
Controls 1μm particles
Controls more than ten metal elements, with each individual metal element controlled within 10-500 PPb.
Controls 0.5μm particles
Controls more than thirty metal elements, with each individual metal element controlled within 10-100 PPb.
Controls 0.5μm particles
Controls more than thirty metal elements, with each individual metal element controlled below 10 PPb.
Controls 0.1μm, 0.2μm, 0.3μm particles
Controls more than thirty metal elements, with each individual metal element controlled below 1 PPb.
Controls 0.2μm, 0.3μm particles
Controls more than thirty metal elements, with each individual metal element controlled below 0.1 PPb.
An acidic mixture of anionic and nonionic surfactants, used in the wafer back corrosion process, passivating the surface.
Use: used for semiconductor high-parameter and complex
Advantages: The advantage of Etch rate in high-parameters is that it is relatively stable. The high-parameter etching rate of our product is 3.5-3.9um/min. And the feedback from customers It has good stability and is also the most mature recommended product.
An acidic mixture of anionic and nonionic surfactants, used in the wafer back corrosion process, passivating the surface.
Purpose: low-parameter semiconductor wafer
Advantages: The etching effect of low-parameter waffle is easier to control, the 10F series products have better results, higher WPH, and customers have better waffle on low-parameter substrate waffle. Positive to the series.
Basic Surfactant Formulation Product, a special product for removing stubborn particles with extremely low surface tension. Very effective for cerium oxide polishing liquid. Clean before and after coating.
Purpose: Remove alumina and cerium oxide, diamond abrasive liquid, light oil, fingerprint, wax, asphalt, particulate matter.
Compatibility: borosilicate glass, Corning 1737 glass, Corning 7059 glass, fused quartz, germanium, sapphire, soda lime glass, quartz, zinc selenide.
Suitable for polishing various glass wafers and window sheets.
Purpose: Mirror polishing effect
Compatible with: SEMI Grade5 Suitable for: Processing technology of integrated circuits above 14 nanometers
Modern production equipment ensures high-quality product production, but we attach more importance to social and environmental protection, and we have invested a lot of money to treat and reuse sewage. The environment is the basis of human survival, and more and more facts have proved that the deterioration of the environment has brought serious disasters to human life.
How to protect the environment and achieve sustainable social development is an issue that each of us must seriously consider. As citizens of the earth in the 21st century, we have the responsibility to work together and make due contributions to the national environmental protection cause.
The waste acid recycling project is included in the green manufacturing project of the 102 major engineering project database of the National Development and Reform Commission's "14th Five-Year Plan" and uses semiconductor chips. During the production process of liquid crystal panels and photovoltaic cells, the mixed acid waste liquid generated by texture etching processing of silicon and other substrates is recycled and reused.
Exclusively introduced foreign technology, through special treatment processes for distillation and removal of metal ions, ultra-pure high-purity hydrofluoric acid, nitric acid and phosphoric acid that meet the industry requirements are regenerated for customer recycling. This has changed the traditional acid-base neutralization treatment method, greatly reduced the amount of solid waste, realized the resource utilization of waste acid, and generated good economic and environmental benefits.
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